Techniques for partitioning radios in wireless communication systems

ABSTRACT

A method and apparatus is provided for partitioning a radio using a multi-chip module to group some or all of the components of the radio in a single package. In one example, a radio uses a multi-chip module, including a chip carrier. Various components of the radio reside in integrated circuits that are mounted to the chip carrier. If desired, one or more antennas can be integrated into the chip carrier.

FIELD OF THE INVENTION

This invention relates to the field of wireless communications. Inparticular, this invention is drawn to techniques for partitioningradios in wireless communication systems.

BACKGROUND OF THE INVENTION

As wireless devices, such as cellular telephones, have become moreintegrated, proper hardware partitioning becomes increasingly important.Generally, when designing a radio, a designer will partition the radiointo functional and hardware blocks. For example, a typical radio may bepartitioned as follows. A transceiver is formed on an integrated circuit(IC), and is mounted on a printed circuit board (PCB). A power amplifieris also formed on an integrated circuit, which is mounted on the samePCB. An antenna is mounted somewhere on the radio and is connected tothe power amplifier and the transceiver for transmitting and receivingsignals.

To improve a radio design, or to move to a higher level of integration,the radio partitioning may be modified. For example, various discretecomponents may be integrated into one of the integrated circuits. Inanother example, where a design includes multiple PCBs, modules, or ICs,the design could be modified by moving one or more components from onePCB to another, and perhaps eliminating a PCB, module, or IC.

Typically, when evaluating where to partition a radio, the antenna israrely considered. The antenna may play an important role in determiningthe overall radio performance, but the performance and integration of anantenna into a system is commonly not considered until the final stagesof design.

SUMMARY OF THE INVENTION

Various apparatuses and methods of the invention are provided for use inwireless communications. In one example, an apparatus includes a chipcarrier, a power amplifier, and an antenna integrated as part of thechip carrier. In another embodiment of the invention, an apparatusincludes first and second integrated circuits. A transceiver resides onthe first integrated circuit. A multi-stage power amplifier residespartially on the first integrated circuit, and partially on the secondintegrated circuit. In other embodiments of the invention an apparatusincludes multiple antennas, which may be used for different frequencybands.

Other features and advantages of the present invention will be apparentfrom the accompanying drawings and from the detailed description thatfollows below.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is illustrated by way of example and notlimitation in the figures of the accompanying drawings, in which likereferences indicate similar elements and in which:

FIG. 1 is a block diagram of a radio implemented using a multi-chipmodule.

FIG. 2 is a block diagram showing another example of a radio implementedusing a multi-chip module.

FIG. 3 is a block diagram showing an example of a radio having a poweramplifier that is integrated using separate dies.

FIG. 4 is a block diagram of the architecture of a radio that uses timedivision multiplexing for transmission and reception using two antennas.

FIG. 5 is a block diagram of the architecture of another exemplary radiousing four antennas.

FIG. 6 is a block diagram of the architecture of another exemplary radiousing four antennas.

FIG. 7 is a block diagram of the architecture of another exemplary radiousing two antennas and circulator circuitry.

DETAILED DESCRIPTION

In order to provide a context for understanding this description, thefollowing description illustrates one example of a typical applicationof the present invention. A radio using techniques of the presentinvention may be used for any desired application, including forwireless transmission systems such as mobile or cellular communicationdevices or other wireless devices. A wireless device may include atransceiver, an antenna switch module, a power amplifier, and anantenna. Coupled between the transceiver and the antenna switch moduleis an RF power amplifier for amplifying signals for transmission via theantenna. In the case of a wireless mobile application, the invention maybe applied to GSM, CDMA, PCS, DCS, etc., or any other wireless systems.This is just one example of an application of a radio utilizing thepresent invention. The invention may also be used in any otherapplication requiring a radio.

In one example, a radio of the present invention uses a multi-chipmodule to group some or all of the components of the radio in a singlepackage. FIG. 1 is a block diagram of a radio 10 implemented using amulti-chip module 12. The module 12 includes a chip carrier 14, andvarious components of the radio, described below. The radio 10 includesa transceiver 16. The transceiver 16 is coupled to a power amplifier 18,which is used to amplify signals to be transmitted by the radio 10. Thepower amplifier 18 and transceiver 16 are coupled to an antenna switchmodule 20, which selectively couples an antenna 22 to the poweramplifier 18 (for transmitting signals) and to the transceiver 16 (forreceiving signals). A baseband controller 24 is coupled to thetransceiver 16. The baseband controller controls various aspects of theoperation of the radio 10. Note that FIG. 1 merely provides one exampleof a radio, and that various other radio configurations could also beused. Furthermore, discrete components are not shown, such as SAWs,resistors, capacitors, inductors, etc.

The multi-chip module 12, in this example, includes a chip carrier 14.In one example, the chip carrier 14 is a multi-layer ceramic chipcarrier, although other types of carriers could also be used. Examplesof suitable types of carriers include, but are not limited to, ceramic,laminate, die paddle, etc. A transceiver 16 resides on a first die(e.g., using CMOS technology), which is mounted to the chip carrier 14.The power amplifier 18, including related power control circuitry,resides on a second die (e.g., using GaAs, SOI, CMOS and/or othertechnology), which is also mounted to the chip carrier 14. An antennaswitch module 20 resides on a third die (e.g., using GaAs, SOI or othertechnology), which is also mounted to the chip carrier 14. Note that theexamples of semiconductor technologies given for each die are merelyexamples, and that any desired technology, or mix of technologies, foreach die can be used. FIG. 1 also shows an antenna 22, as a part of themodule 12. In one example, the antenna 22 is integrated in the ceramicsubstrate of a ceramic chip carrier (such as chip carrier 14). In otherexamples, an antenna can be mounted on the carrier as a separatecomponent. Other functions of the radio (e.g., switch drivers, etc.)could also be integrated, if desired.

In the example shown in FIG. 1, substantially the entire radio,including a transceiver, a power amplifier (and all associatedfunctions), the antenna switch (and all associated functions), and theantenna, is integrated into a single module. Integrating an entire radiosubsystem, and optimizing the critical components to each other, hasseveral advantages. For example, the power amplifier output power andefficiency can be optimized for the insertion loss of the antenna switchmodule and for the characteristics of the antenna. This optimizationallows the current drain on the battery to be minimized. Anotheradvantage is that the specific absorption rate (SAR), harmonics, andnoise are minimized. Another advantage relates to power amplifier rampprofiles. Typically, ramp profiles are stored in memory and areselectively used to control the output power of the power amplifierdepending on the desired output power level. With the integration of thepresent invention, the design of ramp profiles is simplified, since theproperties of the other components of the module 12 are known. In otherless integrated designs, the ramp profiles must be created by the phonemanufacturer only after all transmit components are selected. Anotheradvantage of the present invention relates to radio testing. With theradio 10 shown in FIG. 1, the entire radio module can be tested prior toassembly into a phone (or other wireless product) by a user, or evenguaranteed to pass type approval, thus lowering the costs for phonemanufacturers. With other less integrated designs, the radio can not betested until each of its' components are assembled.

FIG. 2 is a block diagram showing another example of a radio 30implemented using a multi-chip module 32. Generally, radio 30 shown inFIG. 2 is the same as the radio 10 shown in FIG. 1, except that thebaseband controller 24 resides on the same die (illustrated by the box34) as the transceiver 16. In this example, the radio is even moreintegrated than the example shown in FIG. 1.

Like in FIG. 1, the module 32 of FIG. 2 includes a chip carrier 14, andvarious components of the radio, described below. A transceiver 16 andbaseband controller 24 reside on a first die, which is mounted to thechip carrier 14. A power amplifier 18, including related power controlcircuitry, resides on a second die, which is also mounted to the chipcarrier 14. An antenna switch module 20 resides on a third die, which isalso mounted to the chip carrier 14. FIG. 2 also shows an antenna 22, asa part of the module 32. In one example, the antenna 22 is integrated inthe ceramic substrate of the ceramic chip carrier 14. The radio 30 hasall of the advantages of the radio 10 shown in FIG. 1, plus addedadvantages, as a result of the integration of the baseband controller 24with the transceiver 16. For example, lower board space, lower powerconsumption, and other advantages can be realized. The basebandcontroller can also be integrated into the carrier in the followingdescriptions.

By partitioning radios in new ways, the present invention can takeadvantage of various approaches to improve a radio. For example, acomponent of a radio can be configured in such a way that differentparts of the component are integrated into separate integrated circuitsto improve the performance, cost, and/or size of the radio.

FIG. 3 is a block diagram showing an example of a radio 40 having apower amplifier that is integrated using separate die. Generally, radio40 shown in FIG. 3 is the same as the radio 10 shown in FIG. 1, exceptthat the power amplifier is implemented partially in the same die as thetransceiver and partially in the same die as the antenna switch module.It is possible to also integrate the baseband controller as part of onedie that would include the baseband controller, transceiver, and earlypower amplifier stages.

The radio 40 is implemented using a multi-chip module 42. Like in FIG.1, the module 42 of FIG. 3 includes a chip carrier 14, and variouscomponents of the radio, described below. In this example, a transceiver16 resides on a first die 44, which is mounted to the chip carrier 14.An antenna switch module 20 resides on a second die 46, which is alsomounted to the chip carrier 14. A multi-stage power amplifier 18 resideson both dies 44 and 46. The example show in FIG. 3 shows a three stagepower amplifier, although any desired number of stages may be used. Inthis example, the first two power amplifier stages 18A and 18B are lowpower stages, which reside on the die 44, along with the transceiver 16.The final power amplifier stage 18C is a high power stage, which resideson the die 46, along with the antenna switch module 20. FIG. 3 alsoshows an antenna 22, as a part of the module 14. The antenna 22 may beintegrated in the substrate of the chip carrier 14. Note that theintegration of the antenna 22 is optional, but, if integrated, wouldhave all of the advantages discussed above with respect to FIGS. 1 and2. FIG. 3 also shows a baseband controller 24 coupled to the transceiver16. Note that the baseband controller 24 could also be integrated withthe transceiver 16, as is shown in FIG. 2.

The implementation shown in FIG. 3 partitions the radio functions insuch a way that leverages the benefits of different process technologiesand geometries. The exemplary implementation shown in FIG. 3 assumesthat the power amplifier is comprised of multiple amplification stages.In this example, the final stage of the PA generates the greatest poweroutput, and thus requires special architectures and/or special processtechnology. The earlier power amplifier stages generate less power andcould be implemented in standard fine line process technology processes.One advantage of this implementation is the integration and distributionof the power amplifier function into the transceiver die 44 and theswitch die 46. In this implementation, the early and low power stages18A and 18B of the power amplifier, as well as the related power controlcircuitry, are integrated into the transceiver die 44, while the highpower stage 18C of the power amplifier is integrated into the switch die46. Another benefit is the ability to use special calibration oroptimization techniques on the early stages of amplification to provideimprovements in performance. The final stages could also be optimized bysending signals back to the transceiver die or baseband to then act onthe signals.

In one example, the transceiver die 44 is implemented using CMOStechnology (e.g., using 0.13 u CMOS technology), which is appropriatefor the early stages of the power amplifier. The switch module die 46may be implemented using some other technology (e.g., using GaAs, SOI,MEMs, or other technology), which may provide better performance for thefinal stage of the power amplifier. The implementation illustrated inFIG. 3 has several advantages. For example, the power amplifierfunctionality is integrated into the transceiver and switch module dies,decreasing the number of dies, compared to the implementations shown inFIGS. 1 and 2. Another advantage is that this implementation allows thefinal stage of the power amplifier to use a fundamentally more efficientprocess than CMOS, and thus gets potentially better performance in thefinal stage than what would be achieved using CMOS technology. Anotheradvantage is that the predominant power consumption and thermaldissipation (temperature increase) is kept off of the same sensitivetransceiver die, improving performance overall for the radio. Yetanother advantage is that this implementation creates a cost effectivesolution since only the final stage of the power amplifier and theswitch are implemented using higher priced technology (e.g., GaAs, SOI,etc.) while the early power amplifier stages can use the lower cost CMOStechnology.

In other examples, a radio can utilize multiple antennas to simplify theradio design, and lead to various advantages. As illustrated above,integrating an antenna with a power amplifier and switch module leads tosome advantageous architectures. By increasing the number of antennas toaddress multi-band applications, the architecture of a radio can besignificantly simplified to the point where an antenna switch module maynot be necessary. Different antenna configurations will lead todifferent architectures with different advantages, as discussed below.The following exemplary antenna configurations will be discussed in thecontext of the 3GPP (GSM) specification, although it is understood thatother configurations and other contexts are possible within the scope ofthe present invention. Furthermore, the concepts presented above areapplicable to the implementations described below.

FIG. 4 is a block diagram of the architecture of a radio in a GSMmulti-band system. The radio 50 in FIG. 4 is similar to the radiosdescribed above, but with multiple antennas. The radio 50 is implementedusing a multi-chip module 52. Like in FIGS. 1, 2, and 3, the module 52of FIG. 4 includes a chip carrier 14, and various components of theradio, described below. The components of the module 52 reside on one ormore dies, which are mounted to the chip carrier 14. In one example, atransceiver 16 resides on a first die, which is mounted to the chipcarrier 14. Power amplification is provided by two power amplifiers 18Aand 18B. In this example, the power amplifier 18A is used to amplifylow-band signals, and the power amplifier 18B is used to amplifyhigh-band signals. The power amplifiers 18A and 18B are each coupledbetween the transceiver 16 and the antenna switch module 20. In oneexample, the antenna switch module 20 resides on a second die, which ismounted to the chip carrier 14. The power amplifiers 18A and 18B mayreside or a third die (like the power amplifier shown in FIG. 1), or mayreside on two or more separate dies (like the power amplifier shown inFIG. 3). Power control circuitry for the power amplifier is not shown,but could be integrated with the transceiver or on a separate chip.

The radio 50 includes a low-band antenna 22A and a high-band antenna22B. The antennas 22A and 22B may be integrated as a part of the chipcarrier 14, as described above, or may be separate from the chip carrier14. When the radio 50 is operating in a low-band mode, the antennaswitch module 20 will couple the low-band power amplifier 18A to thelow-band antenna 22A, while transmitting low-band signals. Similarly,when the radio 50 is operating in a high-band mode, the antenna switchmodule 20 will couple the high-band power amplifier 18B to the high-bandantenna 22B, while transmitting high-band signals. When the radio isreceiving signals, the antenna switch module 20 couples the appropriateantenna to the transceiver 16, via a filter 54, or similar device. Inone example, the filter 54 is a surface-acoustic-wave (SAW) filter. Notethat the number of antennas can vary depending on radio systemrequirements, as desired.

The implementation illustrated in FIG. 4 has several advantages.Typically, an antenna switch module with a single antenna port willinclude an antenna diplexer to filter signals, as well as to combine thehigh band and low band paths to the antenna. This is done despite thefact that many standard antenna designs for dual band applications(planar, inverted-F, patch, etc.) naturally have separate feedsavailable for the two bands. One proposed idea intends to leverage theseseparate feed connections. One advantage to the implementationillustrated in FIG. 4 is that an antenna diplexer is not required, sincethe high band and low band paths are already separate. Another advantageto having separate high and low band antennas is that each antenna canbe optimized for a narrower frequency band, and for better gain. Anotheradvantage of this implementation is that each antenna can be configuredto have a better response to changing loads. Another advantage of thisimplementation is that improved isolation is achieved when the low-bandpower amplifier is on and high-band power amplifier is off. Thisimprovement is achieved by having the high-band and low-band antennasphysically separated. Further isolation can be achieved by detuning thehigh-band antenna response to further minimize any leakage of energyfrom the low-band transmit path to the high-band antenna. Also of noteis the reduction in loss for each individual path, since the number ofswitch poles is reduced for each separate path, resulting in a moreefficient system solution.

Note that in all the configurations and implementations discussed above,the antenna switch module can contain a harmonic filter that removesunwanted harmonic content from the output of the power amplifiers. Aportion of the insertion loss of a typical antenna switch module is dueto the harmonic filter. In the examples that follow, these harmonicfilters, and their role in the system, will be discussed in more detail.

FIG. 5 is a block diagram of the architecture of another exemplary radio60 in a GSM multi-band system. The radio 60 in FIG. 5 is similar to theradios described above, but with more antennas, and no antenna switchmodule. The radio 60 is implemented using a multi-chip module 62. Likein other figures, the module 62 of FIG. 5 includes a chip carrier 14,and various components of the radio, described below. The components ofthe module 62 reside on one or more dies, which are mounted to the chipcarrier 14. Similarly, the antennas of the radio 60 may be integrated asa part of the chip carrier, or may be separate. The antennas may beseparate antennas, or may have separate electrical connections to asingle resonant antenna structure designed to satisfy the signalisolation required. As is described in detail above, the components ofthe radio 60 can reside on dies in various configurations, as desired.

Power amplification is provided by two power amplifiers 18A and 18B. Inthis example, the power amplifier 18A is used to amplify low-bandsignals, and the power amplifier 18B is used to amplify high-bandsignals. The low-band power amplifier 18A is coupled between thetransceiver 16 and a low-band transmit antenna 22A, via low pass filter64. The high-band power amplifier 18B is coupled between the transceiver16 and a high-band transmit antenna 22B, via low pass filter 66.

For receiving signals, the radio 60 includes separate low-band andhigh-band receiving antennas. A low-band receiving antenna 22C iscoupled to the transceiver 16 via a filter 68. A high-band receivingantenna 22D is coupled to the transceiver 16 via a filter 68. The filter68 may be implemented using a SAW filter, band-pass filter, or any otherdesired type of circuitry. The choice of a particular type of filter maybe based on several factors. For example, if rejection or Q of theantenna can be high enough, a band-pass filter may be suitable. Insteadof the typical SAW filter, the receive filter can then be formed in thesame die as the transceiver 16. Using a band-pass filter could alsoimprove receive sensitivity since a band-pass filter could be made tohave a lower insertion loss than a SAW filter.

As shown, the implementation illustrated in FIG. 5 does not require anantenna switch module. In addition, each antenna can be configured in anoptimal manner, for its' specified purpose. These features lead toseveral advantages over other radios. For example, having no antennaswitches reduces the insertion loss between the power amplifier theantenna. The lack of antenna switches also can reduce the cost of themodule 62. Another advantage of this implementation is that each antennacan be optimized for a narrower frequency band and better gain. Anotheradvantage of this implementation is that the antenna response tochanging loads is improved. Another advantage of this implementation isthat the receive sensitivity of the receive antennas will be improvedsince there is less insertion loss as a result of eliminating theantenna switch as well as potentially eliminating the SAW filter.Another advantage of this implementation is that power amplifier outputpower can be reduced, which increases the efficiency of the radio.Another advantage of this implementation is that the implementationenables optimal matching of each power amplifier to its' associatedantenna. This includes the case where the power amplifier implementationor performance may be improved by presenting a custom impedance specificto that particular antenna. This applies similarly for the receive pathsas well. This implementation also simplifies the required software usedto operate the radio, and increases efficiency of the radio.

One key challenge in designing power amplifier for wirelesscommunications systems, such as a GSM system, is providing goodperformance across changing loads. Problems can arise when a loadmismatch occurs. In a typical implementation, a power amplifier willexpect a 50 Ohm antenna load. However, due to various conditions, the PAwill rarely operate in an exact 50 Ohm environment. As a result,talk-time and battery life will be dramatically impacted by how well thepower amplifier operates under load mismatch conditions. Furthermore,power amplifier designers may spend considerable time and effortstabilizing power amplifiers to operate under non-50 Ohm conditions.Designers typically make design trade-offs that lower the performance ofa radio for the sake of stability under load mismatch conditions. Bylimiting the range of non-50 Ohm antenna loads that a power amplifierhas to operate over, the power amplifier performance, and overall radioperformance (e.g., talk time and battery life), can be improved.

FIG. 6 is a block diagram of the architecture of another exemplary radio70 in a GSM multi-band system. The radio 70 shown in FIG. 6 is similarto the radio 60 shown in FIG. 5, with the addition of isolators coupledbetween the power amplifiers and the antennas. Like other examplesdescribed above, the radio 70 is implemented using a multi-chip module72. The module 72 of FIG. 6 includes a chip carrier 14, and variouscomponents of the radio, described below. The components of the module72 reside on one or more dies, which are mounted to the chip carrier 14.Similarly, the antennas of the radio 70 may be integrated as a part ofthe chip carrier, or may be separate. As is described in detail above,the components of the radio 70 can reside on dies in variousconfigurations, as desired.

Power amplification in the radio 70 is provided by two power amplifiers18A and 18B. In this example, the power amplifier 18A is used to amplifylow-band signals, and the power amplifier 18B is used to amplifyhigh-band signals. The low-band power amplifier 18A is coupled betweenthe transceiver 16 and a low-band transmit antenna 22A, via filter andisolator circuitry 74. The high-band power amplifier 18B is coupledbetween the transceiver 16 and a high-band transmit antenna 22B, viafilter and isolator circuitry 76. The operation of the isolatorcircuitry 74 and 76 are described below.

For receiving signals, the radio 70 includes separate low-band andhigh-band receiving antennas. A low-band receiving antenna 22C iscoupled to the transceiver 16 via a filter 78. A high-band receivingantenna 22D is also coupled to the transceiver 16 via the filter 78. Thefilter 78 may be implemented using a SAW filter, band-pass filter, orany other desired type of circuitry. If desired, the filter can beformed in the same die as the transceiver 16.

The isolator circuitry functions to limit the range of loads over whichthe power amplifier has to operate. RF isolator circuits permit a signalto pass in one direction, while providing high isolation to reflectedenergy in the reverse direction. In the example shown in FIG. 6, theisolators in the circuitry 74 and 76 will permit signals to pass fromthe power amplifiers 18A and 18B to the antennas 22A and 22B, but willprovide isolation to reflected energy in the reverse direction.Typically, this range limitation is accomplished at the expense ofincreased insertion loss. A typical insertion loss from an isolator ison the order of 0.5 dB. The circuitry 74 and 76 may be implemented inany desired manner, such as the combination of a SAW filter andisolator, or a low-pass filter and isolator, for example.

In addition to some of the same advantages described above with respectto FIGS. 1-5, the implementation show in FIG. 6 has additionaladvantages. Radio output power control is simplified since the poweramplifiers are essentially driving a known impedance, making an openloop power control method more desirable. This feature could be asignificant advantage for WCDMA systems where linearity is important.Another advantage of this implementation is that voltage levels in thepower amplifiers could be easily controlled and the power amplifieritself simplified since the power amplifiers are driving a more limitedrange of load impedances. Likewise, due to the driving of a known load,performance of the power amplifier, in terms of power amplifierefficiency, could be improved.

One way to reduce the complexity of the implementation described aboveis by minimizing the number of antennas. One way that this could beachieved by replacing the isolator circuits with circulators. FIG. 7 isa block diagram of the architecture of another exemplary radio 80 in aGSM multi-band system. The radio 80 shown in FIG. 7 is similar to theradio 70 shown in FIG. 6, except that isolator circuitry is replacedwith circulators.

Like other examples described above, the radio 80 is implemented using amulti-chip module 82. The module 82 of FIG. 7 includes a chip carrier14, and various components of the radio, described below. The componentsof the module 82 reside on one or more dies, which are mounted to thechip carrier 14. Similarly, the antennas of the radio 80 may beintegrated as a part of the chip carrier, or may be separate. As isdescribed in detail above, the components of the radio 80 can reside ondies in various configurations, as desired.

Power amplification in the radio 80 is provided by two power amplifiers18A and 18B. In this example, the power amplifier 18A is used to amplifylow-band signals, and the power amplifier 18B is used to amplifyhigh-band signals. The low-band power amplifier 18A is coupled betweenthe transceiver 16 and a low-band antenna 22A, via filter 84 andcirculator 86. The high-band power amplifier 18B is coupled between thetransceiver 16 and a high-band antenna 22B, via filter 88 and circulator90. Generally, a circulator allows RF energy to pass in one directionwith a small insertion loss, but with high isolation in the oppositedirection. In the configuration illustrated in FIG. 7, RF energy (e.g.,during radio transmission) is allowed to pass from the power amplifiers18A and 18B to the antennas 22A and 22B. RF energy received by theantennas 22A and 22B is allowed to pass to the transceiver 16, via thefilter circuitry 92. In addition to realizing some of the sameadvantages described above with respect to FIG. 6, the implementationshow in FIG. 7 uses only two antennas. In another example, thecirculators 86 and 90 could each be replaced by an isolator followed bya transmit/receive switch.

In the preceding detailed description, the invention is described withreference to specific exemplary embodiments thereof. Variousmodifications and changes may be made thereto without departing from thebroader spirit and scope of the invention as set forth in the claims.The specification and drawings are, accordingly, to be regarded in anillustrative rather than a restrictive sense.

1. An RF apparatus used for wireless communications comprising: a chipcarrier; a power amplifier formed on a first die, wherein the first dieis mounted to the chip carrier; and an antenna electrically coupled tothe power amplifier, wherein the antenna is integrated as part of thechip carrier.
 2. The RF apparatus of claim 1, wherein the chip carrieris a ceramic chip carrier.
 3. The RF apparatus of claim 1, furthercomprising a transceiver mounted to the chip carrier.
 4. The RFapparatus of claim 3, further comprising a baseband controllerelectrically coupled to the transceiver.
 5. The RF apparatus of claim 3,wherein the transceiver is formed on a second die.
 6. The RF apparatusof claim 5, further comprising a baseband controller, wherein thebaseband controller is formed on a second die.
 7. The RF apparatus ofclaim 5, further comprising an antenna switch module electricallycoupled between the power amplifier and the antenna, wherein the antennaswitch module is formed on a third die.
 8. The RF apparatus of claim 7,wherein the antenna switch module is mounted to the chip carrier.
 9. TheRF apparatus of claim 1, further comprising an antenna switch moduleelectrically coupled between the power amplifier and the antenna.
 10. AnRF apparatus used for wireless communications comprising: a firstintegrated circuit; a second integrated circuit; a transceiver formed onthe first integrated circuit; and a multi-stage power amplifierelectrically coupled to the transceiver, wherein at least one stage ofthe multi-stage power amplifier is formed on the first integratedcircuit and at least one stage of the multi-stage power amplifier isformed on the second integrated circuit.
 11. The RF apparatus of claim10, wherein the multi-stage power amplifier includes a first stage and afinal stage, wherein the first stage of the multi-stage power amplifieris formed on the first integrated circuit and the final stage of themulti-stage power amplifier is formed on the second integrated circuit.12. The RF apparatus of claim 10, further comprising a chip carrier,wherein the first and second integrated circuits are mounted to the chipcarrier.
 13. The RF apparatus of claim 12, further comprising an antennaelectrically coupled to the power amplifier, wherein the antenna isintegrated in the chip carrier.
 14. The RF apparatus of claim 13,wherein the chip carrier is a ceramic chip carrier.
 15. The RF apparatusof claim 10, further comprising a baseband controller electricallycoupled to the transceiver.
 16. The RF apparatus of claim 15, furthercomprising an antenna switch module electrically coupled between thepower amplifier and the antenna, wherein the antenna switch module isformed on the second integrated circuit.
 17. A method of providingwireless RF communications comprising: forming a transceiver on a firstintegrated circuit; forming a power amplifier at least partially on asecond integrated circuit, wherein the power amplifier is electricallycoupled to the transceiver; mounting the first integrated circuit to achip carrier; mounting the second integrated circuit to the chipcarrier; and integrating an antenna into the chip carrier, wherein theantenna is electrically coupled to the power amplifier and thetransceiver for transmitting and receiving RF signals.
 18. The method ofclaim 17, wherein the chip carrier is a ceramic chip carrier.
 19. Themethod of claim 17, wherein the power amplifier is a multi-stage poweramplifier, the method further comprising: forming at least one stage ofthe multi-stage power amplifier on the first integrated circuit andforming at least one stage of the multi-stage power amplifier on thesecond integrated circuit.